The Expert Groups of the Academic Alliance

The expert groups are strategic working groups within the Academic Alliance and bring together the various academic chip design communities. They take stock of the current situation, identify needs, develop solution concepts, and draw up position papers. The work of the expert groups forms the basis for science policy discourse. Registration is open to professors and university staff.

Analog / Mixedsignal Design


Head:
Friedel Gerfers
(TU Berlin)

HF Design


Head:
Ingmar Kallfass
(University Stuttgart)

Digital Design


Head:
Tobias Gemmeke
(RWTH Aachen)

Power Elektronics / Power Management


Head:
Bernhard Wicht
(Leibniz University Hanover)

Packaging / Chiplets


Head:
Thomas Zwick
(KIT)

test infrastructure


Head:
Ulrich Heinkel
(TU Chemnitz)

Connection of sensors / optoelectronics / MEMS


Head:
Ralf Brederlow
(TU Munich)

CURRICULA


Head:
Matthias Jung
(University Wurzburg)

Events

© IEEE PRIME Conference
Sep 20, 2026 - Sep 23, 2026
Berlin

PRIME 2026

21st International Conference on PhD Research in Microelectronics and Electronics

More information here
© Fraunhofer IIS
Jun 29, 2026 - Jul 2, 2026
Dresden

SMACD 2026

International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design

More information here
© IdeenExpo
Jun 20, 2026 - Jun 28, 2026
Hannover

IdeenExpo 2026

Europas größtes Jugendevent für Technik und Naturwissenschaften

More information here
© Informationstechnische Gesellschaft ITG VDE e.V.
Jun 19, 2026
Dresden

bits, bonding, bassline

Festival der Elektronik

More information here
May 19, 2026 - May 20, 2026
Baden-Baden

microTEC Clusterkonferenz 2026

More information here
May 6, 2026 - May 7, 2026
Dresden

Chipdesign Germany Forum 2026

More information here
© DATE Conference
Apr 20, 2026 - Apr 22, 2026
Verona

DATE 26 conference

Design, Automation and Test in Europe Conference

More information here