DE-TW-PI3D
Simulation and Design Tools for Photonically Interconnected 2.5D/3D Chip Systems
DE-TW-PI3D develops simulation and design tools for photonically interconnected 2.5D/3D chip systems. Photonic interconnects promise significantly higher bandwidths at considerably reduced energy consumption compared to electrical interconnects.
Objectives and Approach
The goal is to develop a freely accessible open-source simulation tool for designing optical interconnect networks in photonically interconnected 2.5D/3D chip systems for compute-intensive AI applications. The project delivers simulation tools to assess signal quality, performance, and lifespan of interconnect networks, plus algorithms for automated network design.
Innovations and Perspectives
The project deepens German-Taiwanese collaboration in microelectronics, expanding chip design expertise and talent development through scientific networking. The open-source simulator strengthens innovation capacity at German research institutions.
Project Coordinator
- Technische Universität München
Project Partners
- National Cheng Kung University, Tainan
This project is funded by the German Federal Ministry for Research, Technology and Space (BMFTR) as part of the Design Initiative Microelectronics.
