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DI-PASSIONATE

Open-Source Design and Simulation Environment for Highly Integrated 2.5D/3D Chip Systems

DI-PASSIONATE creates an open-source design and simulation environment for highly integrated 2.5D/3D chip systems. These advanced integration technologies enable the combination of heterogeneous chiplets into high-performance systems.

Objectives and Approach

The project develops a free design environment for packages of integrated multi-chip systems by extending existing tools with 3D modeling, electrical, and thermal simulation. A unified component library and overarching workflow enable automated derivation of optimized packages.

Innovations and Perspectives

DI-PASSIONATE closes the existing gap between open-source tools at chip and PCB level, enabling complete coverage of the development chain through free design tools. This strengthens industrial and academic design capabilities in product development, research, and education.

Project Coordinator

This project is funded by the German Federal Ministry for Research, Technology and Space (BMFTR) as part of the Design Initiative Microelectronics.

Events

© IEEE PRIME Conference
Sep 20, 2026 - Sep 23, 2026
Berlin

PRIME 2026

21st International Conference on PhD Research in Microelectronics and Electronics

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© Fraunhofer IIS
Jun 29, 2026 - Jul 2, 2026
Dresden

SMACD 2026

International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design

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© IdeenExpo
Jun 20, 2026 - Jun 28, 2026
Hannover

IdeenExpo 2026

Europas größtes Jugendevent für Technik und Naturwissenschaften

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© Informationstechnische Gesellschaft ITG VDE e.V.
Jun 19, 2026
Dresden

bits, bonding, bassline

Festival der Elektronik

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May 19, 2026 - May 20, 2026
Baden-Baden

microTEC Clusterkonferenz 2026

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May 6, 2026 - May 7, 2026
Dresden

Chipdesign Germany Forum 2026

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© DATE Conference
Apr 20, 2026 - Apr 22, 2026
Verona

DATE 26 conference

Design, Automation and Test in Europe Conference

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